Etched bond pads on the base-lined SiO 2 device bonded with type-3
Figure 2 from Concurrent Optimization of Crescent Bond Pull Force
Gold and Gold Alloy Bonding Wires|TANAKA Precious Metals
Bonding Wire - an overview
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SEM of insulated wire bonds (study A). Dark stripes on deformed
Example crescent bond. (a) BSE-SEM micrograph and location of
PDF) Accelerated characterization of bonding wire materials
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